- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/631 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure for engagement only
Patent holdings for IPC class H01R 13/631
Total number of patents in this class: 2136
10-year publication summary
115
|
123
|
167
|
243
|
243
|
218
|
196
|
205
|
184
|
67
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Sumitomo Wiring Systems, Ltd. | 9367 |
154 |
AutoNetworks Technologies, Ltd. | 5809 |
93 |
Sumitomo Electric Industries, Ltd. | 14131 |
90 |
Yazaki Corporation | 6282 |
83 |
TE Connectivity Solutions GmbH | 2580 |
59 |
Japan Aviation Electronics Industry, Limited | 1585 |
48 |
Iriso Electronics Co., Ltd. | 184 |
45 |
Molex, LLC | 1792 |
41 |
Intel Corporation | 45621 |
30 |
Rosenberger Hochfrequenztechnik GmbH & Co. KG | 677 |
27 |
Foxconn Interconnect Technology Limited | 1034 |
23 |
Aptiv Technologies AG | 2097 |
23 |
CommScope Technologies LLC | 4937 |
21 |
Hirose Electric Co., Ltd. | 325 |
21 |
Robert Bosch GmbH | 40953 |
19 |
Kyocera Corporation | 12735 |
18 |
Lotes Co., Ltd. | 346 |
18 |
Tyco Electronics (shanghai) Co. Ltd. | 759 |
15 |
TE Connectivity Germany GmbH | 655 |
15 |
Molex Incorporated | 609 |
14 |
Other owners | 1279 |